ICFMM 2019
The 4th International Conference on Functional Materials and Metallurgy (ICFMM 2019) will be held in Osaka, Japan on November 27-30, 2019. The objective of ICFMM is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Functional Materials and Metallurgy.
ICFMM has been held successfully in Shanghai (China), University of Malaya, Kuala Lumpur (Malaysia), and China University of Geosciences, Wuhan (China) in the last 3 years. We strongly believe that the 4th edition of the conference will achieve a greater success in the year of 2019. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. Submitted conference papers will be reviewed by technical committees of the Conference.
Proceedings
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Accepted papers after proper registration and presentation will be published with TTP in a volume of Solid State Phenomena. Indexing: Elsevier: SCOPUS www.scopus.com. Index Copernicus Journals Master List www.indexcopernicus.com. Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com. Inspec (IET, Institution of Engineering Technology) www.theiet.org. SCImago Journal & Country Rank (SJR) www.scimagojr.com.Thomson Reuters (WoS). |
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Important Dates
| Paper Submission Deadline |
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| Notification of Acceptance | On October 15, 2019 |
| Authors' Registration | Before October 25, 2019 |
| Camera Ready Confirmation | November 5, 2019 |
| Listener Registration | November 25, 2019 |
Submission Methods
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1. Please log in the
Electronic Submission System
and submit your paper 2. You can also submit the papers via email to icfmm@young.ac.cn Template Download Notice For presentation only, please submit an abstract. When publication is concerned, full paper submission is compulsory. The conference secretary will contact you within 3 work days when your submission is well received. If you do not receive any feedback then, please contact us. |
Other Links
Latest News
November 6, 2019 News!
The detail program can be downloaded now. (Click)
October 29, 2019 News!
Prof. Agnieszka Pawlowska, Assoc. Prof. Jonbi and Asst. Prof. Dongong Meng joined in the technical committee!
September 25, 2019 News!
Prof. Oswaldo Mauricio González join in technical committee.
August 27, 2019 News!
Prof. Vishvesh J Badheka, Dr. Purnima Swarup Khare, and
Prof. Mei-Chin Chen join in technical committee.
August 16, 2019 News!
Upon requests from authors, the submission deadline is
extended to September 30.
August 5, 2019 News!
Martin Necpal, Oswaldo Mauricio González, Alexey Korchunov, Guo Peimin,
Yu-Cheng Chen, and Lai Chin Wei join in technical committee.
July 8, 2019 News!
Prof. Guang Xu, Prof. Chang-Hee Yim, and Prof. NamChol Yu etc. experts join in technical committee.
June 11, 2019 News!
Prof. Tetsuji Saito and Assoc. Prof. Bushroa Binti Abd Razak join in technical committee.
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